Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 8L and 14L SOIC package at MTAI assembly site.Pre Change: Using Palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated First Ship Date: February 22, 2018 (date code: 1808)
Data Sheet - TC4404/TC4405 Data Sheet Data Sheet Document Revision Description of Change: 1) Removed all information regarding the discontinued CERDIP package. 2) Added Temperature Specifications Table. 3) Added Section 5.0, Packaging Information. 4) Added Product Identification System page.NOTE: Please be advised that this is a change to the document only the product has not been changed.