Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products for 200K wafer technology available in 40L UQFN package at NSEB assembly site.Pre Change: Using gold (Au) bond wire material.Post Change:Using palladium coated copper with gold flash (CuPdAu) bond wire material.Reason for Change:To improve manufacturability and qualify CuPdAu bond wire at NSEB assembly site. Estimated Qualification Completion Date: March 2018Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.
Data Sheet - PIC16LF1904/6/7 Data Sheet Data Sheet Document Revision Description of Change: Minor changes to Figure 22-2, Table 22-8, and Table 22-10, in Electrical Specifications chapter; Updated Packaging: 28L SOIC, 44L TQFP, 28L UQFN, 40L UQFN. Removed Table 19-7, LCD Worksheet.NOTE: Please be advised that this is a change to the document only the product has not been changed.