Notification of Intent to Utilize an Alternate Qualified Assembly and Test Site for Select Flip Chip Ball Grid Array Devices Change Description The backend assembly and test of MachXO3, iCE5 and LIF-UC family devices in the flip chip BGA package is to be transferred from the Amkor Philippines (ATP) site to the Amkor Korea (ATK) site. ATP will discontinue the flip chip BGA backend assembly by the end of 2018, and has advised current customers to qualify affected devices at the ATK site.
Notification of Changes to the MachXO2 and MachXO3 Family Data SheetsThe new MachXO2 Family Data Sheet (DS1035 Version 03.1, released in March 2016) updates the timing specifications governing PROGRAMN assertion to DONE de-assertion time tDPPDONE, and PROGRAMN assertion to INITN de-assertion time tDPPINIT. The specifications change from 80ns maximum to 150ns maximum. These same changes will appear in the MachXO3 Family Data Sheet