Laser marking replaces INK marking method DESCRIPTION OF CHANGE: An approved assembly subcontractor for IXYS Corporation will change the method they use to mark molded plastic packages; Laser marking will replace ink marking. The change to laser marking will be phased in throughout 2015 on a lot by lot basis.
Marking Process Change
Laser Brand TransitionIXYS Integrated Circuits Division will be changing device marking from ink branding to laser mark. This change will only affect the visual appearance (or form) of the devices listed in this Product Change Notification.