This notification is to advise our customers that IDT is converting to Copper bond wire for the selective products at the existing qualified assembly sub-contractors.There is no change in the moisture sensitivity performance.
Molding Compound Change
This revised notice is to amend the mold compound materials for select packages as shown in the supplier document. The PCN effective date remains unchanged.
Assembly Site Change
This notification is to advise our customers that IDT is adding Greatek, Taiwan as an alternate assembly facility for parts that are currently assembled at Amkor Philippines.There is no change to the moisture performance.